Specifications

Documentation

Specifications

FEATURES:

  • Rectangular LED RF performance
    • 450 nm - 18+ mW
    • 460 nm - 18+ mW
    • 470 nm - 16+ mW
  • Clear Adhesive Die Attach
  • Low forward voltage - 3.3 V typ @ 20 mA
  • 2 kV ESD rating
  • InGaN junction on thermally conductive SiC substrate
  • 50 μm and 115 μm chip thickness options

Documentation

Data Sheets Version Last Updated

C

11 Jan 2019

Sales Terms Version Last Updated

M

29 Jun 2018