EZ1950-p LED Chips

EZBright p-pad up LED Chips

Cree’s EZBright® LEDs are the newest generation of solid-state LED emitters that combine highly efficient InGaN materials with Cree’s proprietary optical design and device submount technology to deliver superior value for highintensity LEDs. The optical design maximizes light extraction efficiency and enables a Lambertian radiation pattern. Additionally, these LEDs are die-attachable with conductive adhesive, solder paste or solder preforms, as well as flux eutectic attach. These vertically structured, low forward voltage LED chips are approximately 220 microns in height and are tested for conformity to optical and electrical specifications. Cree’s EZ™ chips are useful in a broad range of applications such as general illumination, automotive lighting and mobile flash.

Cree EZ1950-p EZBright LED Chips

Specifications

Documentation

Specifications

Features:

  • Lambertian radiation pattern
  • Anode-up design (p-pad up)
  • EZBright LED technology, binned @ 700 mA 
    • 450 nm – 1120+ mW
    • 460 nm – 1120+ mW
  • Low forward voltage (VF) – 3.2 V typical at 700 mA
  • Maximum DC forward current: 3000 mA
  • Backside metal versions for various attach methods:
    • A (AuSn) for use with conductive adhesives, flux eutectic attach, solder paste and solder preforms
    • G (LTDA) for low-temperature flux eutectic attach

Documentation

Application Notes Version Last Updated
Cree® EZ-p™ LED Handling and Packaging Recommendations

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04 Aug 2017
Data Sheets Version Last Updated
EZ1950-p LED Chips Data Sheet

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16 Mar 2015
Product Ecology Version Last Updated
EZ LED Chips REACh Declaration

EZ1000, EZ290, EZ600, EZ700, EZ900

RE1005072018

12 Sep 2018
Sales Terms Version Last Updated
Sales Terms and Conditions

M

29 Jun 2018