Specifications

Documentation

Specifications

FEATURES:

  • Lambertian radiation pattern
  • Anode-up design (p-pad up)
  • EZBright LED technology, binned @ 350 mA
    • 450 nm: 640+ mW
    • 460 nm: 620+ mW
  • Low forward voltage (Vf): 3.0 V typical at 350 mA
  • Backside metal for use with flux eutectic die attach, solder paste and solder preforms
    • A (AuSn) for use with conductive adhesives, flux eutectic attach, solder paste & solder preforms
    • G (LTDA) for low temperature flux eutectic attach

Documentation

Application Notes Version Last Updated

-

04 Aug 2017

Data Sheets Version Last Updated

C

11 Jan 2019

Product Ecology Version Last Updated
EZ LED Chips REACh Declaration

EZ1000, EZ290, EZ600, EZ700, EZ900

RE1005072018

12 Sep 2018

Sales Terms Version Last Updated

M

29 Jun 2018