CGHV96050F2

50-W, 7.9 – 9.6-GHz, 50-ohm, Input/Output-Matched GaN HEMT

Cree’s CGHV96050F2 is a gallium-nitride (GaN) high-electron-mobility transistor (HEMT) on silicon-carbide (SiC) substrates. This GaN internally matched (IM) FET offers excellent power added efficiency in comparison to other technologies. GaN has superior properties compared to silicon or gallium arsenide, including higher breakdown voltage, higher saturated electron drift velocity and higher thermal conductivity. GaN HEMTs also offer greater power density and wider bandwidths compared to GaAs transistors. This IM FET is available in a metal/ceramic flanged package for optimal electrical and thermal performance.

Features

  • 8.4 - 9.6 GHz Operation
  • 80 W POUT typical
  • 10 dB Power Gain
  • 55 % Typical PAE
  • 50 Ohm Internally Matched
  • <0.1 dB Power Droop

Applications

Related Documents

Data Sheets Version Last Updated
2.0 23 Oct 2014
RF Application Notes Version Last Updated
A 30 Apr 2012
A 30 Apr 2012
RF Product Ecology Version Last Updated
RS4060082013 29 Apr 2014
Sales Terms Version Last Updated
S-parameter Version Last Updated
Technical Papers & Articles Version Last Updated
by Raymond S. Pengelly, Simon M. Wood, James W. Milligan, Scott T. Sheppard, and William L. Pribble
Design 01 Jun 2012
by Yifeng Wu and Primit Parikh

The vacuum tubes used in today's millimeter-wave transmitters face an increasing threat from GaN HEMTs. Cree's Yifang Wu and Primit Parikh are leading the GaN charge with designs that incorporate field plates, iron-doped buffer layers and a thin AIN interlayer to deliver a record power at 30 GHz.
Article 01 Jan 2006