UT170, 50-um, Gen 3 LED Chips
UltraThin Generation 3
Cree’s UltraThin™ LEDs combine highly efficient InGaN materials with Cree’s proprietary G•SiC® substrate to deliver superior price/performance for blue LEDs. These vertically structured LED chips are small in size and require a low forward voltage. Cree’s UT™ series chips are tested for conformity to optical and electrical specifications and the ability to withstand 1000-V ESD.
Applications include keypad backlighting where sub-miniaturization and thinner form factors are required.