Specifications

Documentation

Specifications

FEATURES:

  • Lambertian Radiation Pattern
  • Anode-up design (p-pad up)
  • EZBright LED Technology, binned @ 350 mA
    • 450 nm – 540+ mW
    • 460 nm – 520+ mW
    • 470 nm – 480+ mW
    • 527 nm – 170+ mW
  • Low Forward Voltage (Vf) – 3.1 V Typical at 350 mA
  • Maximum DC Forward Current – 1500 mA
  • Backside Metal versions for various attach methods:
    • -A (AuSn) for use with Conductive Adhesives, Flux Eutectic Attach, Solder Paste & Solder Preforms
    • -G (LTDA) for Low Temperature Flux Eutectic Attach

Documentation

Data Sheets Version Last Updated

D

26 Jun 2017

Product Ecology Version Last Updated
EZ LED Chips REACh Declaration

EZ1000, EZ290, EZ600, EZ700, EZ900

RE1005012017

20 Jan 2017

EZ LED Chips RoHS Declaration

EZ1000, EZ290 - 3-uM Bond Pad, EZ290 - 6-uM Bond Pad, EZ600, EZ700, EZ900, EZ950

RS1005062015

02 Jun 2015

Sales Terms Version Last Updated