Specifications

Documentation

Specifications

Features:

  • Lambertian radiation pattern
  • Anode-up design (p-pad up)
  • EZBright LED technology, binned @ 700 mA 
    • 450 nm – 1120+ mW
    • 460 nm – 1120+ mW
  • Low forward voltage (VF) – 3.2 V typical at 700 mA
  • Maximum DC forward current: 3000 mA
  • Backside metal versions for various attach methods:
    • A (AuSn) for use with conductive adhesives, flux eutectic attach, solder paste and solder preforms
    • G (LTDA) for low-temperature flux eutectic attach

Documentation

Data Sheets Version Last Updated

-

16 Mar 2015

Product Ecology Version Last Updated
EZ LED Chips REACh Declaration

EZ1000, EZ290, EZ600, EZ700, EZ900

RE1005012017

20 Jan 2017

Sales Terms Version Last Updated
Sales Terms and Conditions

RT320 Gen 3 20-mA LED Chips