UT190-85 Gen III LED Chips

UltraThin Generation III

Cree’s UltraThin™ LEDs combine highly efficient InGaN materials with Cree’s proprietary G•SiC® substrate to deliver superior price/performance for blue LEDs. These vertically structured LED chips are small in size and require a low forward voltage. Cree’s UT™ series chips are tested for conformity to optical and electrical specifications and the ability to withstand 1000-V ESD. 

Applications include keypad backlighting where sub-miniaturization and thinner form factors are required.

FEATURES:

  • Small chip – 190 x 190 x 50 μm
  • UT LED performance
    – 450 & 460 nm – 12 mW min.
    – 470 nm – 10 mW min.
    – 527 nm – 3.0 mW min.
  • Low forward voltage
    – 2.9 V typical at 5 mA
  • Single wire bond structure
  • Class 2 ESD rating

Applications

Related Documents

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