DA700 LED Chips

Direct Attach

Cree’s Direct Attach™ DA700 LEDs are the next generation of solid-state LED emitters that combine highly efficient InGaN materials with Cree’s proprietary device technology and silicon-carbide substrates to deliver superior value for the TV-backlighting and general-illumination markets. The DA700 LEDs are among the brightest in the lighting market while delivering a low forward voltage, resulting in a very bright and highly efficient solution. The bondpad-down design allows for eutectic die attach, eliminating the need for wire bonds, and enables superior performance from improved thermal management.

FEATURES:

  • Direct-attach LED technology
  • Rectangular LED RF performance – 450 & 460 nm – 430 mW min
  • High reliability - eutectic attach
  • Low forward voltage (Vf) – 3.3 V typical at 350 mA
  • Maximum DC forward current – 750 mA
  • InGaN junction-down design for improved thermal management
  • No wire bonds required

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