May 14, 2013

Cree’s New Power Module Enables Higher-Performance, More-Reliable and Lower-Cost Power Conversion Systems Compared to State-Of-The Art Silicon Modules

Industry’s First All-SiC Three-Phase Power Module Alleviates Conventional Design Constraints
DURHAM, NC -- Cree, Inc. (Nasdaq: CREE) is introducing the industry’s first commercially available silicon-carbide (SiC) six-pack power module in an industry-standard 45-mm package. When replacing a silicon module with equivalent ratings, Cree’s six-pack module can reduce power losses by 75 percent, which leads to an immediate 70 percent reduction in the size of the heat sink or a 50 percent increase in power density. The new six-pack SiC module unlocks the traditional design constraints associated with power density, efficiency and cost, thereby enabling the designer to create high-performance, reliable and low-cost power-conversion systems. When compared to state-of-the-art silicon modules, the SiC 1.2 kV, 50 A modules deliver performance equivalent to silicon modules rated at 150 A.

“The efficient switching of the SiC modules allows us to use them with significantly less derating than silicon IGBTs,” stated Dr. Jun Kang, research and applications manager, Yaskawa America, Inc. “This feature enables significantly higher frequency operation, which both increases fundamental output frequency and reduces passive component size in the motor drive.”

“Cree’s SiC power module family can also provide significant benefits to applications such as solar inverters, uninterruptible power supplies (UPS) and industrial power supplies,” explained Mrinal Das, product marketing manager, Cree Power and RF. “Even when designers simply substitute Si modules with SiC in motor-drive applications, the improved performance of SiC reduces power losses, leading to reduced cooling requirements and, in turn, to a reduction in size, weight, complexity and the overall cost of the power-electronics system.”

The CCS050M12CM2 six-pack modules from Cree are available for immediate shipping through Digi-Key Corporation and Mouser Electronics. Gate-driver ICs suitable for SiC MOSFETs are available from IXYS and Texas Instruments. Complete gate driver boards (CRD-001) are available as samples from Cree upon request. For further information about the new Cree® SiC six-pack module, please visit www.cree.com/SiC-modules. Visitors to the PCIM 2013 Conference, May 14–16, in Nuremburg, Germany, can learn more about the new six-pack module at Hall 7, Booth 210.

About Cree
Cree is a market-leading innovator of semiconductor products for power and radio-frequency (RF) applications, lighting-class LEDs and LED lighting solutions.

Cree's product families include LED fixtures and bulbs, blue and green LED chips, high-brightness LEDs, lighting-class power LEDs, power-switching devices and RF devices. Cree products are driving improvements in applications such as general illumination, electronic signs and signals, power supplies and solar inverters.

For additional product and company information, please refer to www.cree.com.

This press release contains forward-looking statements involving risks and uncertainties, both known and unknown, that may cause actual results to differ materially from those indicated. Actual results may differ materially due to a number of factors, including the risk that actual savings will vary from expectations; the risk we may be unable to manufacture these new products with sufficiently low cost to offer them at competitive prices or with acceptable margins; the risk we may encounter delays or other difficulties in ramping up production of our new products; customer acceptance of our new products; the rapid development of new technology and competing products that may impair demand or render Cree’s products obsolete; and other factors discussed in Cree’s filings with the Securities and Exchange Commission, including its report on Form 10-K for the year ended June 24, 2012, and subsequent filings.