October 6, 2011

Cree’s New Z-RecTM Silicon Carbide Schottky Diodes Improve Energy Efficiency in Solar Micro Inverter Designs

TO-252 D-Pak Devices Now Available in 2A, 5A, 8A & 10A Ratings
-- Cree, Inc. (Nasdaq: CREE), a market leader in silicon carbide (SiC) power devices, continues its mission of advancing the adoption of SiC into mainstream power applications. Cree’s advances in SiC technology are setting new standards in energy efficiency while reducing system costs and improving reliability when compared to silicon-based power devices. Cree’s latest addition to its 1200V SiC Schottky diode product offering includes four new surface mount devices in 2A, 5A, 8A, and 10A current ratings and packaged in the industry-standard surface mount TO-252 D-Pak. Cree is the first manufacturer to offer this comprehensive range of current ratings for commercially available 1200V SiC Schottky diodes in the surface mount D-Pak package. Designers of systems, such as solar micro inverters, now have more options to develop smaller, lighter and less costly power conversion circuits. The new surface mount devices deliver the same proven performance as Cree’s TO-220 Schottky diodes, but with a smaller PCB footprint and lower profile.

“These new surface mount devices provide all the proven benefits of SiC Schottky diodes – zero reverse recovery losses, temperature-independent switching, higher frequency operation with low EMI, and significantly higher surge and avalanche capability – with a smaller footprint and a lower board-mounted profile,” explained Cengiz Balkas, Cree VP and GM, Power and RF. “The new 2A device is ideally suited for lower power applications allowing them to benefit from the advantages of SiC while providing the best performance and cost option. With the addition of the 8A and 10A devices, the same space and cost savings can be extended to higher power applications”

“There are significant design advantages to implementing SiC power devices in high efficiency power electronics systems, including the ability to achieve higher current and voltage ratings with fewer components. By reducing the component count, designers can achieve lower overall system costs with increased reliability and maximum efficiency,” continued Balkas. “When used in conjunction with Cree’s new series of 1200V SiC Power MOSFETs in an all-SiC design, these Schottky diodes make it possible to achieve high-efficiency power electronics systems with switching frequencies that are 5x to 8x higher when compared to conventional silicon solutions. The higher switching frequencies enable smaller magnetic and capacitive elements, thereby shrinking system size, weight and cost.”

Cree’s C4D02120E Series Schottky diodes are rated for 2A/1200V; the C4D05120E Series diodes are rated for 5A/1200V; the C4D08120E Series diodes are rated for 8A/1200V; and the C4D10120E Series diodes are rated for 10A/1200V. Operating junction temperature for all C4DXX120E devices is rated for -55°C to +175°C.

The C4DXX120E surface mount Schottky diodes are fully qualified and released for production use. Check with Cree for availability of devices in die form. For samples and more information about Cree’s SiC power devices, please visit www.cree.com/power.

About Cree
Cree is a market-leading innovator of semiconductor solutions for wireless and power applications, lighting-class LEDs, and LED lighting solutions.

Cree’s product families include power-switching devices, radio-frequency/wireless devices, blue and green LED chips, high-brightness LEDs, lighting-class power LEDs, and LED fixtures and bulbs. Cree solutions are driving improvements in applications such as variable-speed motors, wireless communications, general illumination, backlighting and electronic signs and signals.

For additional product and company information, please refer to www.cree.com.

This press release contains forward-looking statements involving risks and uncertainties, both known and unknown, that may cause actual results to differ materially from those indicated. Actual results may differ materially due to a number of factors, including the risk that we may be unable to manufacture these products with sufficiently low cost to offer them at competitive prices or with acceptable margins; the risk we may encounter delays or other difficulties in ramping up production of our new products; customer acceptance of the new products; the rapid development of new technology and competing products that may impair demand or render Cree’s products obsolete; and other factors discussed in Cree’s filings with the Securities and Exchange Commission, including its report on Form 10-K for the year ended June 26, 2011, and subsequent filings.