UT170, 50-um, Gen 3 LED Chips

UltraThin Generation 3

Cree’s UltraThin® LEDs combine highly efficient InGaN materials with Cree’s proprietary G•SiC® substrate to deliver superior price/performance for blue LEDs. These vertically structured LED chips are small in size and require a low forward voltage. Cree’s UT™ series chips are tested for conformity to optical and electrical specifications and the ability to withstand 1000-V ESD. 

Applications include keypad backlighting where sub-miniaturization and thinner form factors are required.

FEATURES:

  • Small chip: 170 x 170 x 50 μm
  • Single wire bond structure
  • UT LED performance
    • 450 nm: 12+ mW
    • 460 nm: 12+ mW
    • 470 nm: 10+ mW
    • 527 nm: 4+ mW
  • Low forward voltage: 2.95 V typical at 5 mA
  • Class 2 ESD rating

Related Documents

Data Sheets Version Last Updated
- 29 Oct 2014
Sales Terms Version Last Updated