EZ950-p LED Chips

Cree’s EZBright® LEDs are the newest generation of solid-state LED emitters that combine highly efficient InGaN materials with Cree’s proprietary optical design and device submount technology to deliver superior value for high-intensity LEDs. 

The optical design maximizes light extraction efficiency and enables a Lambertian radiation pattern. Additionally, these LEDs are die-attachable with conductive adhesive, solder paste or solder preforms, as well as flux eutectic attach. 

These vertically structured, low-forward-voltage LED chips are approximately 170 microns in height. 

Cree’s EZ™ chips are tested for conformity to optical and electrical specifications. 

These LEDs are useful in a broad range of applications such as general illumination, automotive lighting and mobile flash.

FEATURES:

  • EZBright LED technology
    • 450 nm – 440+ mW
    • 460 nm – 420+ mW
    • 470 nm – 400+ mW
    • 527 nm – 170+ mW
  • Lambertian radiation pattern
  • Backside Metal versions for various attach methods:
    “-G” for use with flux eutectic die attach, solder-paste and solder preforms
    “-H” for use with conductive adhesives
  • Low forward voltage
  • Dielectric passivation across epi surface
  • Anode-up design

Related Documents

Data Sheets Version Last Updated
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