EZ400-p LED Chips

Cree’s EZBright® LEDs are the latest generation of solid-state LED emitters that combine highly efficient InGaN materials with Cree’s proprietary optical design and device technology to deliver superior value for high-intensity LEDs. The optical design maximizes light extraction efficiency and enables a Lambertian radiation pattern. Additionally, these LEDs are die attachable with conductive epoxy, solder paste or solder preforms, as well as the flux eutectic method. These vertically structured, low forward voltage LED chips are approximately 170 microns in height. Cree’s EZ™ chips are tested for conformity to optical and electrical specifications. These LEDs are useful in a broad range of applications, including automotive lighting, wearable devices, video displays and LCD backlighting.

FEATURES:

  • Lambertian Radiation Pattern
  • Anode-up design (p-pad up)
  • EZBright LED Technology, binned @ 175 mA   
    • 450 nm – 180+ mW
    • 460 nm – 180+ mW
    • 470 nm – 160+ mW
    • 527 nm – 40+ mW
  • Forward Voltage (Vf) – 3.4 V Typical at 175 mA
  • Maximum DC Forward Current – 200 mA
  • Backside Metal versions for various attach methods:
    • -A (AuSn) for use with Conductive Adhesives, Flux Eutectic Attach, Solder Paste & Solder Preforms
    • -H (Au) for Conductive Adhesives (i.e. Ag paste)
  • 2kV Class 2 ESD Rating

Related Documents

Data Sheets Version Last Updated
- 01 Dec 2016
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