EZ1950-p LED Chips

Cree’s EZBright® LEDs are the newest generation of solid-state LED emitters that combine highly efficient InGaN materials with Cree’s proprietary optical design and device submount technology to deliver superior value for high-intensity LEDs. The optical design maximizes light extraction efficiency and enables a Lambertian radiation pattern.

Additionally, these LEDs are die-attachable with conductive adhesive, solder paste or solder preforms, as well as flux eutectic attach.

These vertically structured, low forward voltage LED chips are approximately 220 microns in height
and are tested for conformity to optical and electrical specifications.

Cree’s EZ™ chips are useful in a broad range of applications, such as general illumination, automotive lighting and mobile flash.

Features:
  • Lambertian radiation pattern
  • Anode-up design (p-pad up)
  • EZBright LED technology, binned @ 700 mA 
    • 450 nm – 1120+ mW
    • 460 nm – 1120+ mW
  • Low forward voltage (VF) – 3.2 V typical at 700 mA
  • Maximum DC forward current: 3000 mA
  • Backside metal versions for various attach methods:
    • A (AuSn) for use with conductive adhesives, flux eutectic attach, solder paste and solder preforms
    • G (LTDA) for low-temperature flux eutectic attach

Related Documents

Data Sheets Version Last Updated
- 16 Mar 2015
LED Chips Product Ecology Version Last Updated
EZ1000, EZ290, EZ600, EZ700, EZ900
RE1005032016 08 Mar 2016
Sales Terms Version Last Updated