EZ1350-p LED Chips

Cree’s EZBright® LEDs are the newest generation of solid-state LED emitters that combine highly efficient InGaN materials with Cree’s proprietary optical design and device submount technology to deliver superior value for high-intensity LEDs. 

The optical design maximizes light extraction efficiency and enables a Lambertian radiation pattern. 

Additionally, these LEDs are die-attachable with conductive epoxy, solder paste or solder preforms, as well as the flux eutectic attach method. 

These vertically structured, low-forward-voltage LED chips are approximately 170 microns in height. Cree’s EZ™ chips are tested for conformity to optical and electrical specifications. 

These LEDs are useful in a broad range of applications such as general illumination, automotive lighting and mobile flash.

FEATURES:

  • EZBright LED technology
    • 450 nm – 520+ mW
    • 460 nm – 500+ mW
  • Lambertian radiation pattern
  • Backside metal for use with flux eutectic die attach, solder paste and solder preforms
  • Low forward voltage
  • Dielectric passivation across epi surface
  • Anode-up design

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